Products
Printed Circuit Boards
- Rigid Multilayer up to 36 layers
- Blind via 0.075mm
- Buried via 0.1mm
- Laser via 0.075mm
- Filling via (copper or non-conductive paste)
- Plugged (via-filler SD-2361)
- Conductor width/space 0.035 mm
- PCB Thickness <0.1 - 5.0 mm
- Surface finishes: - HASL - ENIG - Immersion Tin - ENIG/Hard Gold
- Flex & Rigid-Flex Multilayer
- Maximum Rigid Flex Layers - 24
- Maximum Flex layers - 11
- Sequential Lamination 2-6 cycles or more
- Bending radius 6-10 times PCB thickness
- Build-up’s: Symmetrical and Asymmetrical
- Minimum track/space >= 35 – 100 microns
- Material Polyimide: Pyralux DuPont
- HDI
- Impedance controlled PCBs
- Thick Copper (max Cu thickness - 1mm)
- High Temperature Boards
- Sequential Lamination Stack Build
- Hybrid Stackups
- High Frequency Boards
- Rigid-Flex & Flex
Assemblies
- Laser marking - ASYS INSIGNUM 4000 LASER
- Stencil printing – EKRA SERIO 5000
- SPI – KOH YOUNG KY8030-2 3D
- Inspection Test - TAKAYA APT-1400F
- Repair station - HYBRID REWORK SYSTEM ERSA HR 600/2
- Latest SMT and THT equipment for Rigid, Rigid-Flex and Flex boards
- Pick&Place – SIPLACE ASM SXI & ASM SX2
- Vapor phase – ASSCON REFLOW OVEN VP7000
- Reflow System – ERSA HOTFLOW 3/20
- Through hole soldering – Selective Soldering System ERSA VERSAFLOW 4/55
- AOI - KOH YOUNG ZENITH 3D
- Depaneling - DEPANELING SYSTEM DIVISIO 5100 DUAL